TEF6890H Datasheet | NXP Semiconductors

.. INTEGRATED CIRCUITS DATA SHEET TEF6890H Car radio integrated signal processor Product specification 2003 Oct 21 Philips Semiconductors Product specification Car radio integrated signal processor CONTENTS 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 2 3 4 5 6 7 7.1 7.2 7.3 7.4 7.4.1 7.4.2 7.5 7.6 7.6.1 7.6.2 7.6.3 7.6.4 7.6.5 7.6.6 7.6.7 7.7 8 9 10 11 Features General I2C-bus Stereo decoder Noise blanking Weak signal processing RDS demodulator Tone/volume part GENERAL DESCRIPTION ORDERING INFORMATION QUICK REFERENCE DATA BLOCK DIAGRAM PINNING FUNCTIONAL DESCRIPTION Stereo decoder FM and AM noise blanker High cut control and de-emphasis Noise detector FM noise detector AM noise detector Multipath/weak signal processing Tone/volume control Input selector Loudness Volume/balance Treble Bass Fader/mute Beep generator and NAV input with output mixer RDS demodulator LIMITING VALUES THERMAL CHARACTERISTICS CHARACTERISTICS I2C-BUS PROTOCOL 11.1 11.1.1 11.1.2 11.1.3 11.2 11.2.1 11.2.2 11.2.3 11.2.4 11.2.5 11.2.6 11.2.7 11.2.8 11.2.9 11.2.10 11.2.11 11.2.12 11.2.13 11.2.14 11.2.15 11.2.16 11.2.17 11.2.18 12 13 14 14.1 14.2 14.3 14.4 14.5 15 16 17 18 Read mode Data byte 1; STATUS Data byte 2; LEVEL Data byte 3; USN and WAM Write mode Subaddress 2H; RDSCLK Subaddress 4H; CONTROL Subaddress 5H; CSALIGN Subaddress 6H; MULTIPATH Subaddress 7H; SNC Subaddress 8H; HIGHCUT Subaddress 9H; SOFTMUTE Subaddress AH; RADIO Subaddress BH; INPUT and ASI Subaddress CH; LOUDNESS Subaddress DH; VOLUME Subaddress EH; TREBLE Subaddress FH; BASS Subaddress 10H; FADER Subaddress 11H; BALANCE Subaddress 12H; MIX Subaddress 13H; BEEP Subaddress 1FH; AUTOGATE TEST AND APPLICATION INFORMATION PACKAGE OUTLINE SOLDERING Introduction to soldering surface mount packages Reflow soldering Wave soldering Manual soldering Suitability of surface mount IC packages for wave and reflow soldering methods DATA SHEET STATUS DEFINITIONS DISCLAIMERS PURCHASE OF PHILIPS I2C PONENTS 2003 Oct...