FEATURES
I I I I I I Symmetrical output impedance High noise immunity Low power dissipation Balanced propagation delays SOT353-1, SOT753, SOT886, and SOT891 package options ESD protection: N HBM JESD22-A114E: exceeds 2000 V N MM JESD22-A115-A: exceeds 200 V N CDM JESD22-C101C: exceeds 1000 V I Specified from −40 °C to +125 °C 3. Ordering information Table 1. Ordering information Package Temperature range XC7SH125GW XC7SH125GV XC7SH125GM XC7SH125GF −40 °C to +125 °C −40 °C to +125 °C −40 °C to +125 °C −40 °C to +125 °C Name TSSOP5 SC-74A XSON6 XSON6 DESCRIPTION
plastic thin shrink small outline package; 5 leads; body width 1.25 mm plastic surface-mounted package; 5 leads Version SOT353-1 SOT753 Type number plastic extremely thin small outline package; no SOT886 leads; 6 terminals; body 1 × 1.45 × 0.5 mm plastic extremely thin small outline package; no leads; 6 terminals; body 1 × 1 × 0.5 mm SOT891 Free Datasheet NXP Semiconductors XC7SH125 Bus buffer/line driver; 3-state 4. Marking Table 2.
NXP Semiconductors
