TDA8925 Description
revision 5 Printed-circuit board Curves measured in reference design PACKAGE OUTLINES SOLDERING Introduction to soldering through-hole mount packages Soldering by dipping or by solder wave Manual soldering Suitability of through-hole mount IC packages for dipping and wave soldering methods DATA SHEET STATUS DEFINITIONS DISCLAIMERS 2004 May 06 2 Philips Semiconductors .. Product specification Power stage 2 x 15 to 25...