GBPC50
Key Features
- Glass passivated chip junction
- Low reverse leakage current
- High surge current capability
- Low power loss
- High efficiency
- Electrically isolated metal case for maximum heat dissipation Mechanical Data
- Case: Molded plastic body with heatsink
- Terminals: Plated lead Solderable (Add “W” suffix for Wire Leads)
- Polarity: As marked on Case
- Mounting: Through hole for #10 Screw
