AGN20012 Overview
Key Specifications
Package: DIP
Mount Type: PCB, Through Hole
Pins: 8
Height: 9 mm
Key Features
- Outstanding surge resistance. Surge withstand between open contacts: 1,500 V 10×160 µs (FCC part
- Surge withstand between contacts and coil: 2,500 V 2×10 µs (Bellcore)
