M2F2G64CB88BHN Description
Modules use eight 256Mx8 (2GB) 78-ball BGA packaged devices and sixteen 256Mx8 (4GB) 78-ball BGA packaged devices. These DIMMs are manufactured using raw cards developed for broad industry use as reference designs. The use of these mon design files minimizes electrical variation between suppliers.
M2F2G64CB88BHN Key Features
- Performance: Speed Sort DIMM CAS Latency fck
- Clock Frequency tck
- Clock Cycle fDQ
- Programmable Operation
- DIMM Latency: 6,7,8,9,10,11
- Burst Type: Sequential or Interleave
- Burst Length: BC4, BL8
- Operation: Burst Read and Write
- Two different termination values (Rtt_Nom & Rtt_WR)
- 15/10/1 (row/column/rank) Addressing for 2GB