74ABT245 Datasheet | National Semiconductor

Description The ’ABT245 contains eight non-inverting bidirectional buffers with TRI-STATE outputs and is intended for bus-oriented applications Current sinking capability is 64 m A on both the A and B ports The Transmit Receive (T R) input determines the direction of data flow through the bidirectional transceiver Transmit (active HIGH) enables data from A ports to B ports Receive (active LOW) enables data from B ports to A ports The Output Enable input when HIGH disables both A and B ports by placing them in a High Z condition Features Y Bidirectional non-inverting buffers Y A and B output sink capability of 64 m A source capa- bility of 32 m A Y Guaranteed output skew Y Guaranteed multiple output switching specifications Y Output switching specified for both 50 p F and 250 p F loads Y Guaranteed simultaneous switching noise level and dy- namic threshold performance Y Guaranteed latchup protection Y High impedance glitch-free bus loading during entire power up and power down cycle Y Non-destructive hot insertion capability Y Disable time is less than enable time to avoid bus contention Y Standard Military Drawing (SMD) 5962-9214801 mercial Military Package Number Package Description 74ABT245CSC (Note 1) M20B 20-Lead (0 300 Wide) Molded Small Outline JEDEC 74ABT245CSJ (Note 1) M20D 20-Lead (0 300 Wide) Molded Small Outline EIAJ 74ABT245CPC N20B 20-Lead (0 300 Wide) Molded Dual-In-Line 54ABT245J 883 J20A 20-Lead Ceramic Dual-In-Line 74ABT245CMSA (Note 1) MSA20 20-Lead Molded Shrink Small Outline EIAJ Type II 54ABT245W 883 W20A 20-Lead Cerpak 54ABT245E 883 E20A 20-Lead Ceramic Leadless Chip Carrier Type C 74ABT245CMTC (Notes 1 2) MTC20 20-Lead Molded Thin Shrink Small Outline JEDEC Note 1 Devices also available in 13 reel Use suffix e SCX SJX MSAX and MTCX Note 2 Contact factory for package availability Logic Symbol Connection Diagrams Pin Assignment for DIP Flatpak SSOP and SOIC Pin Assignment for LCC TL F 10945- 1 TRI-STATE is a registered...