74F241 Datasheet | National Semiconductor

Description The ’F240 ’F241 and ’F244 are octal buffers and line drivers designed to be employed as memory and address drivers clock drivers and bus-oriented transmitters receivers which provide improved PC and board density Features Y TRI-STATE outputs drive bus lines or buffer memory address registers Y Outputs sink 64 m A (48 m A mil) Y 12 m A source current Y Input clamp diodes limit high-speed termination effects Y Guaranteed 4000V minimum ESD protection mercial 74F240PC 74F240SC (Note 1) 74F240SJ (Note 1) 74F241PC 74F241SC (Note 1) 74F241SJ (Note 1) 74F244PC 74F244SC (Note 1) 74F244SJ (Note 1) 74F244MSA (Note 1) Military 54F240DM (Note 2) 54F240FM (Note 2) 54F240LM (Note 2) 54F241DM (Note 2) 54F241FM (Note 2) 54F241LM (Note 2) 54F244DM (Note 2) 54F244FM (Note 2) 54F244LM (Note 2) Package Number N20A J20A M20B M20D W20A E20A N20A J20A M20B M20D W20A E20A N20A J20A M20B M20D MSA20 W20A E20A Package Description 20-Lead (0 300 Wide) Molded Dual-In-Line 20-Lead Ceramic Dual-In-Line 20-Lead (0 300 Wide) Molded Small Outline JEDEC 20-Lead (0 300 Wide) Molded Small Outline EIAJ 20-Lead Cerpack 20-Lead Ceramic Leadless Chip Carrier Type C 20-Lead (0 300 Wide) Molded Dual-In-Line 20-Lead Ceramic Dual-In-Line 20-Lead (0 300 Wide) Molded Small Outline JEDEC 20-Lead (0 300 Wide) Molded Small Outline EIAJ 20-Lead Cerpack 20-Lead Ceramic Leadless Chip Carrier Type C 20-Lead (0 300 Wide) Molded Dual-In-Line 20-Lead Ceramic Dual-In-Line 20-Lead (0 300 Wide) Molded Small Outline JEDEC 20-Lead (0 300 Wide) Molded Small Outline EIAJ 20-Lead Molded Shrink Small Outline EIAJ Type II 20-Lead Cerpack 20-Lead Ceramic Leadless Chip Carrier Type C Note 1 Devices also available in 13 reel Use Suffix e SCX SJX and MSAX Note 2 Military grade device with environmental and burn-in processing Use suffix e DMQB FMQB and LMQB TRI-STATE is a registered trademark of National Semiconductor Corporation C1995 National Semiconductor Corporation TL F 9501 RRD-B30M75 Printed in U S A Connection...