CP3SP33 Datasheet | National Semiconductor

Description The CP3SP33 connectivity processor bines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with 4Kbyte instruction cache and a Teak® DSP coprocessor provides high puting bandwidth, DMA-driven hardware munications peripherals provide high I/O bandwidth, and an external bus provides system expandability. In addition to providing the features needed for the next generation of embedded Bluetooth products, the CP3SP33 is backed up by the software resources that designers need for rapid time-to-market, including an operating system, Bluetooth protocol stack implementation, peripheral drivers, reference designs, and an integrated development environment. bined with an external program memory and a On-chip munications peripherals include: Bluetooth Bluetooth radio transceiver such as National’s LMX5252, Lower Link Controller, Universal Serial Bus (2.0) OTG node the CP3SP33 provides a plete Bluetooth system soluand host controller, dual CAN, dual Microwire/Plus/SPI, tion. dual ACCESS.bus, quad UART, 10-bit A/D converter, and National Semiconductor offers a plete and industrytelematics/audio codec. Additional on-chip peripherals in- proven application development environment for CP3SP33 clude DMA controller, dual CVSD/PCM conversion module, applications, including the IAR Embedded Workbench, I2S and AAI digital audio bus interfaces, Timing and Watch- i SYSTEM win IDEA and i C3000 Active Emulator, Bluetooth dog Unit, dual Versatile Timer Unit, dual Multi-Function Tim- Development Board, Bluetooth protocol stack, and applicaer, and Multi-Input Wake-Up (MIWU) unit. tion examples. Block Diagram .. Bluetooth is a registered trademark of Bluetooth SIG, Inc. and is used under license by National Semiconductor. Teak is a registered trademark of Parthus Ceva, Inc. TRI-STATE is a registered trademark of National Semiconductor Corporation. ©2005 National Semiconductor Corporation .national. Features...