• Part: DS32EV100
  • Description: Programmable Single Equalizer
  • Manufacturer: National Semiconductor
  • Size: 672.32 KB
Download DS32EV100 Datasheet PDF
National Semiconductor
DS32EV100
DS32EV100 is Programmable Single Equalizer manufactured by National Semiconductor.
Description The DS32EV100 programmable equalizer provides pensation for transmission medium losses and reduces the medium-induced deterministic jitter for NRZ data channel. The DS32EV100 is optimized for operation up to 3.2 Gbps for both cables and FR4 traces. The equalizer channel has eight levels of input equalization that can be programmed by three control pins. .. The equalizer supports both AC and DC-coupled data paths for long run length data patterns such as PRBS-31, and balanced codes such as 8b/10b. The device uses differential current-mode logic (CML) inputs and outputs, and is available in a 3 mm x 4 mm 14-pin leadless LLP package. Power is supplied from either a 2.5V or 3.3V supply. Features - - - - - - - - - - Equalizes up to 14 d B loss at 3.2 Gbps 8 levels of programmable equalization Operates up to 3.2 Gbps with 40” FR4 traces 0.12 UI residual deterministic jitter at 3.2 Gbps with 40” FR4 traces Single 2.5V or 3.3V power supply Supports AC or DC-Coupling with wide input monmode Low power consumption: 100 m W Typ at 2.5V Small 3 mm x 4 mm 14-pin LLP package >8 k V HBM ESD -40 to 85°C operating temperature range Simplified Application Diagram © 2007 National Semiconductor Corporation .national. Pin Diagram .. Top View 3mm x 4mm 14-Pin LLP Package Order number DS32EV100 See NS Package Number SQA14A Pin Descriptions Pin Name Pin Number I/O, Type I, CML Description HIGH SPEED DIFFERENTIAL I/O IN- IN+ OUT- OUT+ BST_2 BST_1 BST_0 POWER VDD GND Exposed Pad OTHER RSVD 1 Reserved. Leave no Connect. 5 2, 6, 9, 10, 13 PAD Power Power Power VDD = 2.5V ±5% or 3.3V ±10%. VDD pins should be tied to VDD plane through low inductance path. A 0.01μF bypass capacitor should be connected between each VDD pin to GND planes. Ground reference. GND should be tied to a solid ground plane through a low impedance path. Ground reference. The exposed pad at the center of the package must be connected to ground plane of the board. 4 3...