Download DS75110A Datasheet PDF
National Semiconductor
DS75110A
DS75110A is Dual Line Drivers manufactured by National Semiconductor.
Description The DS75110A is a dual line driver with independent channels, mon supply and ground terminals featuring constant current outputs. These drivers are designed for optimum performance when used with the DS75107, DS75108 line receivers. The output current of the DS75110A is nominally 12 m A and may be switched to either of two output terminals with the appropriate logic levels at the driver input. Separate or mon control inputs are provided for increased logic versatility. These control or inhibit inputs allow the output current to be switched off (inhibited) by applying low logic levels to the control inputs. The output current in the inhibit mode, IO(Off), is specified so that minimum line loading is induced. This is highly desirable in system applications using party line data munications. Features n Improved stability over supply voltage and temperature ranges n Constant current, high impedance outputs n High speed: 15 ns max propagation delay n Standard supply voltages n Inhibitor available for driver selection n High mon mode output voltage range (- 3.0V to 10V) n TTL input patibility Connection Diagram 14- Lead Dual-In-Line Package and SO-14 Package Function Table Inputs Logic 1 X X L X H H = High L = Low X = Don’t Care Outputs Inhibitor A/B L X H H H INH X L H H H A1/B1 Off Off Off Off On A2/B2 Off Off On On Off 2 X X X L H DS009619-1 Top View Order Number DS75110AM or DS75110AN See NS Package Number M14A or N14A © 1999 National Semiconductor Corporation DS009619 .national. Absolute Maximum Ratings (Note 2) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Storage Temperature Range Ceramic DIP Molded DIP and SO-14 Lead Temperature Ceramic DIP (Soldering, 60 sec.) - 65˚C to +175˚C - 65˚C to +150˚C 300˚C Molded DIP and SO-14 (Soldering, 10 sec.) 265˚C Maximum Power Dissipation (Note 1) at 25˚C Molded Package 1040 m W SO Package 930 m W ±...