• Part: LM386
  • Description: Low Voltage Audio Power Amplifier
  • Manufacturer: National Semiconductor
  • Size: 251.75 KB
Download LM386 Datasheet PDF
National Semiconductor
LM386
LM386 is Low Voltage Audio Power Amplifier manufactured by National Semiconductor.
Description The LM386 is a power amplifier designed for use in low voltage consumer applications. The gain is internally set to 20 to keep external part count low, but the addition of an external resistor and capacitor between pins 1 and 8 will increase the gain to any value up to 200. The inputs are ground referenced while the output is automatically biased to one half the supply voltage. The quiescent power drain is only 24 milliwatts when operating from a 6 volt supply, making the LM386 ideal for battery operation. Features n n n n n n n n n Battery operation Minimum external parts Wide supply voltage range: 4V- 12V or 5V- 18V Low quiescent current drain: 4 m A Voltage gains from 20 to 200 Ground referenced input Self-centering output quiescent voltage Low distortion Available in 8 pin MSOP package Applications n n n n n n n n AM-FM radio amplifiers Portable tape player amplifiers Inters TV sound systems Line drivers Ultrasonic drivers Small servo drivers Power converters Equivalent Schematic and Connection Diagrams Small Outline, Molded Mini Small Outline, and Dual-In-Line Packages DS006976-2 DS006976-1 Top View Order Number LM386M-1, LM386MM-1, LM386N-1, LM386N-3 or LM386N-4 See NS Package Number M08A, MUA08A or N08E © 2000 National Semiconductor Corporation DS006976 .national. Absolute Maximum Ratings (Note 2) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage (LM386N-1, -3, LM386M-1) Supply Voltage (LM386N-4) Package Dissipation (Note 3) (LM386N) (LM386M) (LM386MM-1) Input Voltage Storage Temperature Operating Temperature Junction Temperature Soldering Information 15V 22V 1.25W 0.73W 0.595W ± 0.4V - 65˚C to +150˚C 0˚C to +70˚C +150˚C Dual-In-Line Package Soldering (10 sec) +260˚C Small Outline Package (SOIC and MSOP) Vapor Phase (60 sec) +215˚C Infrared (15 sec) +220˚C See AN-450 “Surface Mounting Methods and Their Effect...