APPLICATIONS
s GENERAL DESCRIPTION
In addition to SSOP16, ultra small and thin packages FFP16 (Flip-Chip Fine Package) and PCSP16 (Plastic Chip Size Package) is applied. It is suitable for cellular phone, PDA and portable game. s PACKAGE OUTLINE NJM2705PB1 NJM2705SD3 NJM2705V s FEATURES
q Operating Voltage q Operating Current 1.8 to 6V 0.7mA typ. at Active mode 1µA max. at Standby mode q Low Output Noise 10µVrms typ (2SP/HP/1SP mode, VR : max.) q Variable Surround Effect by external resistor (Adjustable for speaker and headphone independently.) q Standby Function q Internal Mode Control Switch q Bipolar Technology q Package Outline FFP16, PCSP16, SSOP16 s BLOCK DIAGRAM LOUT LIN 3D Filter 1SP Surround ROUT 3D Enhancer RIN Bypass mode 2SP mode Surround mode HP mode 1SP mode -1- NJM2705 s PIN CONFIGURATION FFP16 (Top View) 12 11 10 13 14 15 16 1 PCSP16 (Top View) 9 8 7 6 5 1. 2. 3. 4. 5. 6. 7. 8. LIN RIN LOUT ROUT NFSPR NFHPR NFSPL NFHPL 9. LMON 10. PS 11. SW2 12. SW1 13. STBY 14. V+ 15. GND 16.