Datasheet4U Logo Datasheet4U.com

MSC1163 - 40-Bit Anode Driver

General Description

The MSC1163 is a monolithic IC using the Bi-CMOS process for hybridizing CMOS and bipolar transistors on the same chip.

Key Features

  • The MSC1163 is designed as a VFD anode driver with emitter-follower output providing 40-bit active pull-down and built-in 40-bit bidirectional shift register and latch.
  • Logic Supply Voltage (VCC) : 5V.
  • Driver Supply Voltage (VHV) : 65V.
  • Driver Output Current IOHVH :.
  • 2mA IOHVL : 2mA.
  • Built-in 40-bit output with latch.
  • Built-in 40-bit bidirectional shift register.
  • Clock frequency: 4MHz.
  • Package: 60-pin plastic SSOP (SSOP60-P-.

📥 Download Datasheet

📁 Similar Datasheet

Part Number Description Manufacturer
MSC1200 Precision ADC/DAC Burr-Brown
MSC1200-01 30-Bit Duplex Controller/Driver OKI electronic componets
MSC1200V-01 30-Bit Duplex Controller/Driver OKI electronic componets
MSC1201 Precision ADC/DAC Burr-Brown Corporation
MSC1201-XX 60-Bit VFD Tube Driver OKI electronic componets

Other Datasheets by OKI Electric

Part Number Description
MSC1162A 40-Bit Vacuum Fluorescent Display Tube Grid/Anode Driver
MSC1164 20-Bit Grid/Anode Driver
MSC1157 Speaker Drive Amplifier
MSC23232D DYNAMIC RAM MODULE

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
E2C0010-27-Y4 ¡ Semiconductor MSC1163 ¡ Semiconductor 40-Bit Anode Driver This version: Nov. 1997 MSC1163 Previous version: Jul. 1996 GENERAL DESCRIPTION The MSC1163 is a monolithic IC using the Bi-CMOS process for hybridizing CMOS and bipolar transistors on the same chip. The logic portion such as the input stage, shift register and latch is fabricated by CMOS and the output driver requiring a high withstand voltage is fabricated by bipolar transistors. Since the 60-pin plastic SSOP package is adopted and the pin configuration allows the circuit wiring to be formed on the single side PCB, the display unit size can be reduced.