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CM1244 - 4-Channel ESD Array

Description

5 bump CSP Package Pin Name Description A1 ESD_1 ESD Channel 1 A3 ESD_2 ESD Channel 2 B2 GND Device Ground C1 ESD_3 ESD Channel 3 C3 ESD_4 ESD Channel 4 CM1244 PACKAGE / PINOUT DIAGRAMS Orientation Marking (see Note) A B Top View (Bumps Down View) 123 + 04 C Bottom View

Features

  • Four Channels of ESD Protection.
  • ±15 kV ESD Protection on Each Channel (IEC 61000.
  • 4.
  • 2 Level 4, Contact Discharge).
  • ±30 kV ESD Protection on Each Channel (HBM).
  • Chip Scale Package Features Extremely Low Lead Inductance for Optimum ESD Protection.
  • 5.
  • bump, 0.760 mm x 1.053 mm Footprint, 0.4 mm Pitch, Chip Scale Package (CSP).
  • OptiGuardt Coating for Improved Reliability at Assembly.
  • These Devices are Pb.
  • F.

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Datasheet preview – CM1244

Datasheet Details

Part number CM1244
Manufacturer onsemi
File Size 233.28 KB
Description 4-Channel ESD Array
Datasheet download datasheet CM1244 Datasheet
Additional preview pages of the CM1244 datasheet.

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Full PDF Text Transcription

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CM1244 4-Channel ESD Array in CSP Features • Four Channels of ESD Protection • ±15 kV ESD Protection on Each Channel (IEC 61000−4−2 Level 4, Contact Discharge) • ±30 kV ESD Protection on Each Channel (HBM) • Chip Scale Package Features Extremely Low Lead Inductance for Optimum ESD Protection • 5−bump, 0.760 mm x 1.053 mm Footprint, 0.
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