ESD5482
Features
- Low Capacitance 5 p F
- Low Clamping Voltage
- Small Body Outline Dimensions: 0.60 mm x 0.30 mm
- Low Body Height: 0.3 mm
- Stand- off Voltage: 3.3 V
- Low Leakage
- Response Time is < 1 ns
- IEC61000- 4- 2 Level 4 ESD Protection
- IEC61000- 4- 4 Level 4 EFT Protection
- These Devices are Pb- Free, Halogen Free/BFR Free and are Ro HS pliant
Mechanical Characteristics MOUNTING POSITION: Any QUALIFIED MAX REFLOW TEMPERATURE: 260°C Device Meets MSL 1 Requirements
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
IEC 61000- 4- 2 (ESD)
Contact Air
±10 k V
±10
Total Power Dissipation on FR- 5 Board (Note 1) @ TA = 25°C Thermal Resistance, Junction- to- Ambient
Junction and Storage Temperature Range
Lead Solder Temperature
- Maximum (10 Second Duration)
°PD° Rq JA TJ, Tstg
300 m W
°C/W
- 55 to +150 °C
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage...
