ESD8551
Features
- Low Capacitance (0.30 p F Max, I/O to GND)
- Protection for the Following IEC Standards:
IEC 61000- 4- 2 (Level 4) & ISO 10605
- Low ESD Clamping Voltage
- SZESD8551MXWT5G
- Wettable Flank Package for Optimal
Automated Optical Inspection (AOI)
- SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC- Q101 Qualified and PPAP Capable
- These Devices are Pb- Free, Halogen Free/BFR Free and are Ro HS pliant
Typical Applications
- USB 3.0
- MHL 2.0
- e SATA
MAXIMUM RATINGS (TJ = 25C unless otherwise noted)
Rating
Symbol
Value
Unit
Operating Junction Temperature Range
- 55 to +125 C
Storage Temperature Range
Tstg
- 55 to +150 C
Lead Solder Temperature
- Maximum (10 Seconds)
C
IEC 61000- 4- 2 Contact IEC 61000- 4- 2 Air ISO 10605 150 p F/2 k W ISO 10605 330 p F/2 k W ISO 10605 330 p F/330 W
20 k V
20
30
30
15
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of...
