FSA642 Datasheet | onsemi

Features - Low On Capacitance: 7.0 p F Typical - Low On Resistance: 7.0 Ω Typical - Wide -3db Bandw idth: 1 GHz Typical - 24-Lead UMLP (2.5 x 3.4 mm) Package - 8 k V ESD Rating; >16 k V Pow er/GND ESD Rating Applications - Dual Camera Applications for Cell Phones - Dual LCD Applications for Cell Phones, Digital Camera Displays, and View finders Description The FSA642 is a bi-directional, low -pow er, high-speed analog sw itch. The pin out is designed to ease differential signal layout and is configured as a triplepole, double-throw sw itch (TPDT). The FSA642 is optimized for sw itching betw een tw o MIPI devices, such as cameras or LCD displays and on-board Multimedia Application Processors (MAP). The FSA642 is patible w ith the requirements of Mobile Industry Processor Interface (MIPI). The low capacitance design allow s the FSA642 to sw itch signals that exceed 500 MHz in frequency. Superior channel-tochannel crosstalk immunity minimizes interference and allow s the transmission of high-speed differential signals and single-ended signals, as described by the MIPI s pec if ic ation. Ordering Information Part Number Top Mark Operating Temperature Range Package FSA642UMX -40 to +85°C 24-Lead, Quad, Ultrathin Molded Leadless Package (UMLP), 2.5 x 3.4 mm Camera 1 Camera 2 DD C MAP Processor LCD 1 LCD 2 DD C MAP Processor Figure 1. Application Block Diagram © 2008 Semiconductor ponents Industries, LLC. December-2017, Rev. 2 Publication Order Number: FSA642/D - Low-Power, Three-Port, High-Speed MIPI Switch Pin Configuration 18 17 16 15 14 13 DB2N CLKAP CLKAN DA1P DA1N DA2P 19 DB2P 20 DB1P 21 DB1N 22 CLKBP 23 CLKBN 24...