HBL2020 Overview
The HBL2020RP provides robust ESD protection for sensitive parts that may be subjected to electrostatic discharge (ESD). The tiny form factor and single wirebond requirement enables it to be used in very confined spaces. The electrical ‘back−to−back zener’ configuration also provides ESD protection in cases where nodes with AC signals are present.
HBL2020 Key Features
- pact Die Protects from ESD Discharges
- Almost No Conduction at Signal Amplitudes Less Than ±4 V
- ESD Protection Over ±8 kV Contact Discharge per MIL_STD_883