MSR860G Datasheet | onsemi

Features - Soft Recovery with Guaranteed Low Reverse Recovery Charge (QRR) and Peak Reverse Recovery Current (IRRM) - 150°C Operating Junction Temperature - Epoxy meets UL 94 V- 0 @ 0.125 in - Low Forward Voltage - Low Leakage Current - These are Pb- Free Devices Mechanical Characteristics: - Case: Epoxy, Molded - Weight: 1.9 Grams (Approximately) - Finish: All External Surfaces Corrosion Resistant and Terminal Leads Readily Solderable - Lead Temperature for Soldering Purposes: 260°C Max. for 10 Seconds MAXIMUM RATINGS Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (Rated VR, TC = 125°C) Peak Repetitive Forward Current (Rated VR, Square Wave, 20 k Hz, TC = 125°C) Non- Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) Storage/Operating Case Temperature Operating Junction Temperature THERMAL CHARACTERISTICS Symbol VRRM VRWM VR IO IFRM IFSM Value 600 8.0 16 100 Unit V Tstg, TC - 65 to +150 TJ - 65 to +150 °C °C Parameter Symbol Value Unit MSR860G Thermal Resistance, Junction- to- Case Thermal Resistance, Junction- to- Ambient Rq JC Rq JA °C/W 1.6 72.8 MSRF860G Thermal Resistance, Junction- to- Case Thermal Resistance, Junction- to- Ambient RRqq JJCA °C/W 4.75 75 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected....