MURA130 Datasheet | onsemi

Features - Small pact Surface Mountable Package with J- Bend Leads - Rectangular Package for Automated Handling - High Temperature Glass Passivated Junction - Low Forward Voltage Drop (0.89 V Max @ 1.0 A, TJ = 150C) - NRVUA and SURA8 Prefixes for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC- Q101 Qualified and PPAP Capable- - These Devices are Pb- Free, Halogen Free/BFR Free and are Ro HS pliant Mechanical Characteristics: - Case: Epoxy, Molded - Weight: 70 mg (Approximately) - Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable - Lead and Mounting Surface Temperature for Soldering Purposes: 260C Max. for 10 Seconds - Polarity: Polarity Band Indicates Cathode Lead - ESD Protection:  Human Body Model > 4000 V (Class 3)  Charged Device Model > 1000 V (Class C5) DATA SHEET .onsemi. ULTRAFAST RECTIFIERS 1 AMPERE, 300- 400 VOLTS SMA CASE 403D MARKING DIAGRAM U4x AYWW G U4x = Device Code x = F for MURA130 = G for MURA140 A = Assembly Location- - Y = Year WW = Work Week G = Pb- Free Package - - The Assembly Location Code (A) is front side optional. In cases where the Assembly Location is stamped in the package bottom (molding ejecter pin), the front side assembly code may be blank. ORDERING INFORMATION Device Package Shipping† SURA8130T3G- VF01- SURA8130T3G- GA01- MURA140T3G SMA 5,000 / Tape (Pb- Free) & Reel NRVUA140VT3G- NRVUA140VT3G- GA01- DISCONTINUED (Note 1) MURA130T3G SURA8130T3G- SMA 5,000 / Tape (Pb- Free) & Reel SURA8140T3G- †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 1. DISCONTINUED: These devices are not remended for new design. Please contact your onsemi representative for information. The most current information on these devices may be available on .onsemi..  Semiconductor ponents Industries, LLC,...