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NSL35TT1 - High Current Surface Mount PNP Silicon Transistor

Features

  • r must set temperatures for several heating zones, and a figure for belt speed. Taken together, these control settings make up a heating “profile” for that particular circuit board. On machines controlled by a computer, the computer remembers these profiles from one operating session to the next. Figure 11 shows a typical heating profile for use when soldering a surface mount device to a printed circuit board. This profile will vary among soldering systems but it is a good starting point. Factor.

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Datasheet Details

Part number NSL35TT1
Manufacturer ON Semiconductor
File Size 199.67 KB
Description High Current Surface Mount PNP Silicon Transistor
Datasheet download datasheet NSL35TT1 Datasheet
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Full PDF Text Transcription

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NSL35TT1 High Current Surface Mount PNP Silicon Low VCE(sat) Transistor for Battery Operated Applications MAXIMUM RATINGS (TA = 25°C) Rating Collector-Emitter Voltage Collector-Base Voltage Emitter-Base Voltage Collector Current − Peak Collector Current − Continuous Electrostatic Discharge Symbol VCEO VCBO VEBO IC ESD THERMAL CHARACTERISTICS Characteristic Symbol Total Device Dissipation TA = 25°C Derate above 25°C PD (Note 1) Thermal Resistance, Junction to Ambient RθJA (Note 1) Total Device Dissipation TA = 25°C Derate above 25°C PD (Note 2) Thermal Resistance, Junction to Ambient RθJA (Note 2) Thermal Resistance, Junction to Lead #3 RθJL Junction and Storage Temperature Range TJ, Tstg 1. FR−4 @ Minimum Pad 2. FR−4 @ 1.0 X 1.0 inch Pad Max Unit −35 Vdc −50 Vdc −5.
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