NSVBSP19AT1G Overview
Key Specifications
Package: TO-261-4
Mount Type: Surface Mount
Pins: 4
Max Operating Temp: 150 °C
Key Features
- High Voltage
- The SOT-223 Package Can Be Soldered Using Wave or Reflow
- SOT-223 Package Ensures Level Mounting, Resulting in Improved Thermal Conduction, and Allows Visual Inspection of Soldered Joints
- The Formed Leads Absorb Thermal Stress During Soldering, Eliminating the Possibility of Damage to the Die
- PNP Complement is BSP16T1G
- Moisture Sensitivity Level (MSL): 1
- NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable
- These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant
