NUP8100D Datasheet | onsemi

Features http://onsemi. 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 - Low Capacitance - Protection for the following IEC Standards: - - - IEC61000- 4- 2 (ESD) 15 k V (air) 8 k V (contact) IEC61000- 4- 4 (EFT) 40 A (5 / 50 ns) EC61000- 4- 5 (lightning) 12 A (8 / 20 ms) Bidirectional Configuration Moisture Sensitivity Level 1 This is a Pb- Free Device- Benefits - Provides Protection for ESD Industry Standards: IEC 61000, HBM - Protects the Line Against Transient Voltage Conditions in Either - - - - - - Direction Minimize Power Consumption of the System Minimize PCB Board Space MARKING DIAGRAM 16 16 1 1 NUP8100D AWLYWWG SOIC- 16 D SUFFIX CASE 751B Applications Wireless munication Circuits RS- 422, RS- 432, and RS- 485 Low Voltage ASICs Ethernet - 10/100 Base T NUP8100D = Specific Device Code A = Assembly Location WL = Wafer Lot Y = Year WW = Work Week G = Pb- Free Package ORDERING INFORMATION Device NUP8100DT1G Package SOIC- 16 (Pb- Free) Shipping 2500 / Tape & Reel - For additional information on our Pb- Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. This document contains information on a product under development. ON Semiconductor reserves the right to change or discontinue this product without notice. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor ponents Industries, LLC, 2006 September, 2006 - Rev. P1 Publication Order Number: NUP8100D/D MAXIMUM RATINGS Parameter ESD Discharge IEC61000- 4- 2 Air Discharge Contact Discharge Symbol VPP Value 15 8.0 300 - 40 to 85 - 55 to 150 260 Unit k V Peak Power Dissipation (8 x 20 m S @ TA = 25°C) Operating Temperature Range Storage Temperature Range Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 seconds) Ppk (Note 1) TOP TSTG TL W °C °C °C Maximum ratings are those...