NXH40T120L3Q1
Features
- Low Package Height
- pact 82.5 mm x 37.4 mm x 12 mm Package
- Options with Press- fit Pins and Solder Pins
- Options with Pre- applied Thermal Interface Material (TIM) and without Pre- applied TIM
- Thermistor
- This Device is Pb- Free and is Ro HS pliant
Applications
- Solar Inverters
- UPS
- Energy Storage Systems
DATA SHEET .onsemi.
Q1 3- TNPC CASE 180AS Solder pins follow similar pattern
MARKING DIAGRAM
NXH40T120L3Q1x G ATYYWW
NXH40T120L3Q1x A T YYWW G
= Device Code = Assembly Site Code = Test Site Code = Year and Work Week Code = Pb- Free Package
PIN CONNECTIONS
Figure 1. NXH40T120L3Q1 Schematic Diagram
ORDERING INFORMATION
See detailed ordering and shipping information on page 5 of this data sheet.
© Semiconductor ponents Industries, LLC, 2017
September, 2021
- Rev. 2
Publication Order Number: NXH40T120L3Q1/D
MAXIMUM RATINGS (Note 1)
Rating
Symbol
Value
Unit
IGBT (Q1, Q4, Q5, Q8, Q9, Q12)
Collector- Emitter Voltage
VCES
Gate-...
