Datasheet4U Logo Datasheet4U.com

NXV10V160ST1 - Automotive Power MOSFET Module

General Description

Pin Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 Pin Name NTC+ NTC

Figure 1.

Key Features

  • 3 Phase MOSFET Module.
  • Electrically Isolated DBC Substrate for Low Thermal Resistance.
  • Temperature Sensing.
  • Compact Design for Low Total Module Resistance.
  • Module Serialization for Full Traceability.
  • AQG324 Qualified and PPAP Capable.
  • Pb.
  • free, RoHS and UL94V.
  • 0 Compliant Typical.

📥 Download Datasheet

Datasheet Details

Part number NXV10V160ST1
Manufacturer onsemi
File Size 525.82 KB
Description Automotive Power MOSFET Module
Datasheet download datasheet NXV10V160ST1 Datasheet

📁 Similar Datasheet

Part Number Description Manufacturer
NXV100XP P-channel Trench MOSFET nexperia
NXV55UN N-channel MOSFET nexperia
NXV75UP P-channel MOSFET nexperia

Other Datasheets by onsemi

Part Number Description
NXV04V120DB1 Three Phase Inverter Automotive Power MOSFET
NXV08A170DB2 Single Phase Inverter Automotive Power MOSFET Module
NXV08B800DT1 Automotive Power MOSFET Module
NXV08H250DPT2 Automotive Power MOSFET Module
NXV08H250DT1 Automotive Power MOSFET Module

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
Automotive Power MOSFET Module NXV10V160ST1 Features • 3 Phase MOSFET Module • Electrically Isolated DBC Substrate for Low Thermal Resistance • Temperature Sensing • Compact Design for Low Total Module Resistance • Module Serialization for Full Traceability • AQG324 Qualified and PPAP Capable • Pb−free, RoHS and UL94V−0 Compliant Typical Applications • 48V E−Compressor and Other 48 V Auxiliaries Benefits • Enable Design of Small, Efficient and Reliable System for Reduced Vehicle Fuel Consumption and CO2 Emission • Simplified Vehicle Assembly • Enable Low Thermal Resistance to Junction−to−Heat Sink by Direct Mounting via Thermal Interface Material between Module Case and Heat Sink DATA SHEET www.onsemi.