NXV10V160ST1
Features
- 3 Phase MOSFET Module
- Electrically Isolated DBC Substrate for Low Thermal Resistance
- Temperature Sensing
- pact Design for Low Total Module Resistance
- Module Serialization for Full Traceability
- AQG324 Qualified and PPAP Capable
- Pb- free, Ro HS and UL94V- 0 pliant
Typical Applications
- 48V E- pressor and Other 48 V Auxiliaries
Benefits
- Enable Design of Small, Efficient and Reliable System for Reduced
Vehicle Fuel Consumption and CO2 Emission
- Simplified Vehicle Assembly
- Enable Low Thermal Resistance to Junction- to- Heat Sink by Direct
Mounting via Thermal Interface Material between Module Case and Heat Sink
DATA SHEET .onsemi.
APM21- CGA CASE MODBQ MARKING DIAGRAM
NXV10V160ST1 = Specific Device Code XXX = Lot ID AT = Assembly & Test Location Y = Year WW = Work Week NNN = Serial Number
ORDERING INFORMATION
See detailed ordering and shipping information on page 2 of this data sheet.
© Semiconductor ponents Industries, LLC, 2022
January, 2024
- Rev....
