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Extremefast Diode with Solderable Top Metal
650 V, 200 A
PCRKA20065F8M1
Features
• AEC−Q101 Qualified • Maximum Junction Temperature 175°C • Extremefast Technology with Soft Recovery • Low Forward Voltage (VF = 1.35 V (Typ.) @ IF = 200 A) • Cathode Pad covered with Solderable Metal Layer
Applications
• Automotive Traction Modules • General Power Modules
DIE DATA SHEET www.onsemi.com
A
C
ORDERING INFORMATION Part Number
Packing
Die Size Anode Area Die Thickness Top Metal Back Metal Topside Passivation Wafer Diameter Max Possible Die Per Wafer
PCRKA20065F8M1
Wafer (sawn on foil)
mils
mm
197 × 394
5,000 × 10,000
183 × 381
4,668 × 9,668
3
78
6 mm AlCu + 1.15 mm Ti/NiV/Ag (STM)
0.