CM6114 Description
The CM6114 is an Application Specific Integrated Passivet (ASIPt) ponent in a 2 x 2, 4−bump, 0.4 mm pitch, CSP form factor. This device is designed for: Fuse Transient Voltage Suppression (TVS) Electrostatic Discharge Protection Electrical Overstress Protection.
CM6114 Key Features
- 4-Bump, 0.8 mm X 0.8 mm Footprint Chip Scale Package (CSP)
- These Devices are Pb-Free and are RoHS pliant
- Rev. P3
- from A1 pin to device ground (Maximum IPP value using 10/1000 ms pulse). See Notes 1 and 2. Failing to nonconductive, I2
- from A2 pin to device ground (Maximum IPP value using 10/1000 ms pulse). See Notes 1 and 2. 1. The device must not burn