MURA110T3G
Key Features
- Small pact Surface Mountable Package with J-Bend Leads
- Rectangular Package for Automated Handling
- High Temperature Glass Passivated Junction
- Low Forward Voltage Drop (0.66 V Max @ 1.0 A, TJ = 150°C)
- SURA8 Prefix for Automotive and Other Applications Requiring
- These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS
- Case: Epoxy, Molded
- Weight: 70 mg (Approximately)
- Finish: All External Surfaces Corrosion Resistant and Terminal
- Lead and Mounting Surface Temperature for Soldering Purposes
