PMBC Overview
Key Specifications
Key Features
- These devices feature very high power handling and low insertion loss due to the epoxy-free optical path
- They are designed to work as pump combiners for EDFA and Raman amplifier systems
- Oplink’s patented packaging technology ensures the highest quality and reliability
- Oplink can provide customized designs to meet specialized feature applications
- Also, Oplink offers modular assemblies that integrate other components to form a full function module or subsystem
