160622 Overview
160622 This specification applies to GaP / GaP LED Chips Structure Mesa structure Electrodes p-side (anode) n-side (cathode) Au alloy Au alloy 3. Outlines (dimensions in microns) p-Electrode p-Epitaxy GaP n-Epitaxy GaP 250 235 n-Electrode n-Epitaxy GaP n-Substrate GaP 235 110 Wire bond contacts can also be square 4. Packing Dice on adhesive film with 1) wire bond side on top 2) back contact on top.