LBL29G Overview
Key Features
- package: standard SMT footprint 0603, colorless diffused resin
- feature of the device: smallest package 1.7 x 0.8 x 0.65 mm (LxWxH); more light due to higher optical efficiency
- wavelength: 470 nm (blue)
- viewing angle: 150°
- technology: ThinGaN®
- optical efficiency: 7 lm/W
- grouping parameter: luminous intensity, wavelength, forward voltage
- assembly methods: suitable for all SMT assembly methods
- soldering methods: IR reflow soldering and TTW soldering
- preconditioning: acc. to JEDEC Level 2
