LOR971 Overview
CHIPLED LO R971, LY R971 Besondere Merkmale Gehäusetyp: 0805 Besonderheit des Bauteils: extrem kleine Bauform 2,0 mm x 1,25 mm x 0,8 mm Wellenlänge:.
LOR971 Key Features
- package: 0805
- feature of the device: extremely small package 2.0 mm x 1.25 mm x 0.8 mm
- wavelength: 590 nm (yellow), 605 nm (orange)
- viewing angle: extremely wide (160°)
- technology: GaAsP (yellow, orange)
- optical efficiency: 1.5 lm/W (yellow), 1.5 lm/W (orange)
- assembly methods: suitable for all SMT assembly methods
- soldering methods: IR reflow soldering
- preconditioning: acc. to JEDEC Level 2
- taping: 8 mm tape with 4000/reel, ø180 mm