• Part: LYQ976
  • Description: Hyper CHIPLED
  • Manufacturer: ams OSRAM
  • Size: 127.07 KB
LYQ976 Datasheet (PDF) Download
ams OSRAM
LYQ976

Key Features

  • package: 0603
  • feature of the device: smallest package 1.6 mm x 0.8 mm x 0.8 mm
  • wavelength: 632 nm (super-red), 605 nm (orange), 587 nm (yellow)
  • viewing angle: extremely wide (160°)
  • technology: InGaAlP
  • optical efficiency: 7 lm/W (super-red), 11 lm/W (orange, yellow)
  • assembly methods: suitable for all SMT assembly methods
  • soldering methods: IR reflow soldering
  • preconditioning: acc. to JEDEC Level 2
  • taping: 8 mm tape with 4000/reel, ø180