OSRAM F1047B
The wafer or its pieces are individually attached on foils (ring). The sampling density is one chip per 1cm².| Part No. | F1047B |
|---|---|
| Datasheet | F1047B Download |
| Manufacturer |  OSRAM |
| Description | Infrared Emitting Diode Chip |
| Buy | Stock & Price |
FEATURES
● Typ. total radiant power: 22 mW @ 100 mA in TOPLED® package.● Chipsize: 300 x 300 µm²
● Very highly efficient GaAlAs LED
● High reliability
● High pulse handling capability
● Good spectral match to silicon photodetectors
● Frontside metallization: aluminum Backside metallization: gold alloy
● Delivery: diced on foil
APPLICATIONS
● IR remote control for hifi and TV sets, video tape recorder, dimmers● Remote control for steady and varying intensity
● Light-reflection switches (max. 500 kHz)
● Sensor technology
● Discrete optocouplers Typ Type F 1047A F 1047B Bestellnummer Ordering Code Q67220-C1386 on request Beschreibung
DESCRIPTION
Infrarot emittierender Chip, Oberseite Kathodenanschluss Infrared emitting die, top side cathode connection Infrarot emittierender Chip, Oberseite Kathodenanschluss, Oberfläche aufgerauht. Infrared emitting die, top side cathode connection, surface frosted 2003-04-11 1 F 1047A, F 1047B Elektrische Werte (TA = 25 °C) Electrical values1) (TA = 25...
