1N5259B Datasheet (PDF) Download
PanJit Semiconductor
1N5259B

Key Features

  • Planar Die construction
  • 500mW Power Dissipation
  • Ideally Suited for Automated Assembly Processes
  • Lead free in pliance with EU RoHS 2011/65/EU directive
  • Case: Molded Glass DO-35
  • Terminals: Solderable per MIL-STD-750, Method 2026
  • Polarity: See Diagram Below
  • Approx. Weight: 0.005 ounces, 0.13 grams
  • B - 2K per Bulk box T/R - 10K per 15" plastic Reel T/B - 5K per horiz. tape & Ammo box