1N5260B Overview
Key Features
- Planar Die construction
- 500mW Power Dissipation
- Ideally Suited for Automated Assembly Processes
- Lead free in compliance with EU RoHS 2011/65/EU directive MECHANICAL DATA
- Case: Molded Glass DO-35
- Terminals: Solderable per MIL-STD-750, Method 2026
- Polarity: See Diagram Below
- Approx. Weight: 0.005 ounces, 0.13 grams
