BZX784C12 Datasheet | PanJit Semiconductor

FEATURES - Planar Die construction - 200 m W Power Dissipation - Zener Voltages from 2.4~75V - Ideally Suited for Automated Assembly Processes - In pliance with EU Ro HS 2002/95/EC directives 0.042(1.05) 0.037(0.95) 0.026(0.65) 0.021(0.55) MECHANICAL DATA - Case: SOD-723, Molded Plastic - Terminals: Solderable per MIL-STD-750, Method 2026 - Polarity: See Diagram Below - Mounting Position: Any - Approx. Weight: 0.00003 ounces, 0.0008 grams 0.007(0.18) 0.003(0.08) 0.057(1.45) 0.053(1.35) 0.006(0.15)MIN. 0.013(0.32) 0.009(0.25) 0.022(0.55) 0.017(0.45) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS PARAMETER Power Dissipation @TA=25o C(Note A) Operating Junction and Storage Temperature Range SYMBOL PD TJ VALUE 200 -55 to +150 UNITS m W OC NOTES: A. Mounted on 5.0mm2(.013mm thick) land areas. September 30,2011-REV.02 C a th o de A node PAGE ....