GDZJ11 Overview
Key Features
- Planar Die construction
- 500mW Power Dissipation
- Ideally Suited for Automated Assembly Processes
- Lead free in compliance with EU RoHS 2011/65/EU directives MECHANICAL DATA
- Case: Molded Glass DO-34
- Terminals: Solderable per MIL-STD-750, Method 2026
- Approx. Weight: 0.0033 ounces, 0.094 grams
