RS1DF
Key Features
- For surface mounted applications in order to optimize board space
- Low profile package
- Easy pick and place
- Fast Recovery times for high efficiency
- Plastic package has Underwriters Laboratory Flammability
- Glass Passivated Junction
- Green molding pound as per IEC61249 Std. . (Halogen Free)
- Case: SMAF molded plastic
- Terminals: Solder plated, solderable per MIL-STD-750,Method 2026
- Polarity: Color band denotes cathode end
