1N5246B Datasheet | PanJit Semiconductor

FEATURES - Planar Die construction - 500m W Power Dissipation - Ideally Suited for Automated Assembly Processes - Lead free in pliance with EU Ro HS 2011/65/EU directive MECHANICAL DATA - Case: Molded Glass DO-35 - Terminals: Solderable per MIL-STD-750, Method 2026 - Polarity: See Diagram Below - Approx. Weight: 0.005 ounces, 0.13 grams - Ordering information: Suffix : “ -35 ” to order DO-35 Package - Packing information - 2K per Bulk box T/R - 10K per 15" plastic Reel T/B - 5K per horiz. tape & Ammo box MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Parameter Symbol Power Dissipation at TA= 25OC PTOT Junction Temperature Storage Temperature Range TSTG Valid provided that leads at a distance of 8mm from case are kept at ambient temperature. Value 500 175 -65 to +175 Units m W OC OC Parameter Symbol Min. Thermal Resistance Junction to Ambient Air RθJA -- For...