BAS316 Datasheet | PanJit Semiconductor

Features - Fast switching speed. - Very low leakage current - Low capacitance - Surface mount package Ideally Suited for Automatic insertion - Lead free in pliance with EU Ro HS 2.0 - Green molding pound as per IEC 61249 standard Mechanical Data - Case: SOD-323 Package - Terminals: Solderable per MIL-STD-750, Method 2026 - Approx. Weight: 0.00014 ounces, 0.0041 grams SOD-323 Maximum Ratings and Thermal Characteristics (TA = 25o C unless otherwise noted) PARAMETER Reverse Voltage Peak Reverse Voltage Maximum Average Forward Current Non-repetitive Peak forward current at TJ(init)=25o C tp = 0.001 ms tp = 1 ms tp = 1 s Repetitive peak forward current tp ≦ 0.5 ms ; D ≦ 0.25 Power Dissipation Maximum Junction Capacitance Measured at 1 MHZ And Applied VR = 0 V Typical Thermal Resistance Operating Junction Temperature Range Storage Temperature Range SYMBOL VR VRM IF(AV) IFSM IFRM PD(1) RθJA (2) RθJC (1) TJ TSTG LIMIT 100 100 250 4 1 0.5 500 400 500 200 -55~150 -55~150 July 3,2025 BAS316-REV.02 UNITS V V m A A m A m W p F o C/W o C o C Page 1 Electrical Characteristics (TA = 25o C unless otherwise...