PANJIT International BZM5249B
SURFACE MOUNT ZENER DIODES
FEATURES
● Planar Die construction● 500mW Power Dissipation
● Ideally Suited for Automated Assembly Processes
● Lead free in comply with EU RoHS 2011/65/EU directives
MECHANICAL DATA
● Case: Molded Glass MICRO-MELF● Terminals: Solderable per MIL-STD-750, Method 2026
● Polarity: See Diagram Below
● Approx. Weight: 0.008 grams
● Mounting Position: Any
● Packing information T/R - 2.5K per 7" plastic Reel 0.043(1.1) 0.040(1.0) 0.048(1.2)DIA. 0.008(0.2) 0.079(2.0) 0.071(1.8) 0.008(0.2)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Parameter Power Dissipation at TA= 25OC Symbol PTOT Junction Temperature TJ Storage Temperature Range TS Valid provided that leads at a distance of 8mm from case are kept at ambient temperature. Value 500 175 -65 to +175 Units mW OC OC Parameter Symbol Min. Thermal Resistance Junction to Ambient Air R●JA -- Forward Voltage at IF = 200mA VF -- Valid provided that leads at a distance of 8mm from case are kept at ambient temperature. Typ. --- Max. 0.3 1 Units oC/mW V May 7,2013-REV.03 PAGE .