PANJIT International BZQ53xxB
SURFACE MOUNT ZENER DIODES
FEATURES
● Planar Die construction● 500mW Power Dissipation (1 .0 67 .7 )
● Ideally Suited for Automated Assembly Processes
MECHANICAL DATA
● Case: Molded Glass QUADRO-MELF● Terminals: Solderable per MIL-STD-202E, Method 208
● Polarity: See Diagram Below
● Approx. Weight: 0.03 grams
● Mounting Position: Any
● Packing information T/R - 2.5K per 7" plastic Reel .020(0.5) .012(0.3) .146(3.7) .130(3.3) .020(0.5) .012(0.3)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Parameter Power Dissipation at Tamb = 25 Junction Temperature Storage Temperature Range O Symbol Value 500 175 -65 to +175 Units mW O C PTOT TJ TS C C O Valid provided that leads at a distance of 10mm from case are kept at ambient temperature. Parameter Thermal Resi stance Juncti on to Ambi ent Ai r Forward Voltage at IF = 100mA Symbol Min. --- Typ. Max. 0.3 1 Uni ts K/mW V RthA VF --- Vali d provi ded that leads at a di stance of 10mm from case are kept at ambi ent temperature. STAD-JAN.27.2004 .063(1.6) .055(1.4)DIA. PAGE .