BZX584C56 Datasheet PDF

FEATURES

● Planar Die construction
● 200mW Power Dissipation
● Zener Voltages from 2.4~75V
● Ideally Suited for Automated Assembly Processes
● Pb free product : 99% Sn above can meet RoHS environment substance diective request

MECHANICAL DATA

● Case: SOD-523, Plastic
● Terminals: Solderable per MIL-STD-750, Method 2026
● Standard packaging : 8mm tape
● Weight : approximately 0.002

MAXIMUM RATINGS

Parameter Power D i ssi pati on @ TA= 25OC (Note A) Operati ng Juncti on and StorageTemperature Range Symbol PD TJ Value 200 -55 to +150 U nits mW O C NOTES: A. Mounted on 5.0mm 2(.013mm thick) land areas. STAD-DEC.20.2005 PAGE . 1 BZX584C2V4~BZX584C75

ELECTRICAL CHARACTERISTICS

Nominal Zener Voltage Part Number No m. V Max. Zener Impedance Z ZT @ IZT Z ZK @ IZK Ω mA Max Reverse Leakage Current IR @ V R uA V V Z @ IZT M i n. V M a x. V Marking C ode W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WK WJ WL WM 17C WN WO WP WR WS 28C WT WU WW WX WY WZ XA X2 X3 X4 X5 P ackag e Ω mA BZX584C2V...