GMZ36 Datasheet | PanJit Semiconductor

FEATURES - Planar Die construction - 500m W Power Dissipation - Ideally Suited for Automated Assembly Processes - Lead free in pliance with EU Ro HS2.0 (2011/65/EU & 2015/865/EU directive) MECHANICAL DATA - Case: Molded Glass MICRO-MELF - Terminals: Solderable per MIL-STD-750, Method 2026 - Approx. Weight: 0.01 grams. - Polarity : Color band denotes cathode end - Packing information T/R - 2.5K per 7" plastic Reel 0.043(1.1) 0.040(1.0) 0.048(1.2)DIA. 0.008(0.2) 0.079(2.0) 0.071(1.8) 0.008(0.2) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Parameter Power Dissipation at TA= 25OC Symbol PTOT Operating Junction Temperature Range Storage Temperature Range TSTG Valid provided that leads at a distance of 10mm from case are kept at ambient temperature. Value 500 175 -65 to + 175 Units m W OC OC Parameter Thermal Resistance Junction to Ambient Air Symbol RΘJA Min. -- Forward Voltage at I F= 100m A VF -- Valid provided that leads at a distance of 10mm from case are kept at ambient temperature. Typ. --- Max. 0.3 Units o C/m...