MBR19AFC Datasheet | PanJit Semiconductor

Features - Low power loss, high efficiency - High surge current capability - Lead free in pliance with EU Ro HS 2.0 - Green molding pound as per IEC 61249 standard SMAF-C Mechanical Data - Case : Molded plastic, SMAF-C - Terminals : Solderable per MIL-STD-750, Method 2026 - Approx. Weight : 0.0012 ounces, 0.034 grams Maximum Ratings and Thermal Characteristics (TA = 25o C unless otherwise noted) PARAMETER Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current Peak Forward Surge Current : 8.3 ms Single Half Sine-Wave Superimposed On Rated Load Instantaneous Forward Voltage at 1A Reverse Current(Note 3) Typical Junction Capacitance Measured at 1 MHz And Applied VR = 4V (Note 1) Typical Thermal Resistance (Note 2) Operating Junction Temperature Range Storage Temperature Range SYMBOL MBR18AFC MBR19AFC MBR110AFC MBR115AFC MBR120AFC UNIT VRRM VRMS IF(AV) IFSM VF IR RθJL RθJA TJ TSTG 0.8 0.05 V m A 30 p F 19 150 -55 to +150 -55 to +150 o C/W o C o C NOTES : 1. Mounted on a FR4 PCB, single-sided copper, with 48cm2 copper pad area. 2. Mounted on a FR4 PCB, single-sided copper, standard footprint. 3. Short duration pulse test used to minimize self-heating effect. August 26,2020 MBR18AFC_SERIES-REV.00S...