PANJIT International MMBZ5259BTW
SURFACE MOUNT SILICON ZENER DIODES
FEATURES
● Planar Die Construction● 200mW Power Dissipation
● Zener Voltages from 2.4~51V
● Ideally Suited for Automated Assembly Processes
● In compliance with EU RoHS 2002/95/EC directives
MECHANICAL DATA
● Case: SOT-363, Plastic● Terminals: Solderable per MIL-STD-750, Method 2026
● Approx. Weight: 0.0002 ounces, 0.006 grams
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(TJ=25OC unless otherwise noted) PARAMETER Power Dissipation (Note A) Peak Forward Surge Current,8.3ms single half sine-wave superimposed on rated load (JEDEC method) (Notes B) Operating Junction Temperature and Storage Temperature Range SYMBOL PD IFS M TJ ,TSTG VALUE 200 2.0 -55 to +150 UNITS mW A OC NOTES: A. Mounted on 5.0mm2 (.013mm thick) land areas. B. Me asured on 8.3ms, single half sine-wave or equivalent square wave, duty cycle=4 pulses per minute maximum. October 06,2011-REV.02 PAGE