SMF110A Datasheet | PanJit Semiconductor

FEATURES - For surface mounted applications in order to optimize board space. - Ultra Thin Profile Package for Space Constrained Utilization - Package suitable for Automated Handling - Low inductance - High temperature soldering : 260OC/10 seconds at terminals - ESD IEC-61000-4-2 Air + 30k V, Contact + 30k V - Lead free in pliance with EU Ro HS 2011/65/EU directive - Green molding pound as per IEC61249 Std. . (Halogen Free) MECHANICAL DATA - Case: SOD-123FL, Plastic - Terminals: Solderable per MIL-STD-750, Method 2026 - Polarity: Color band denotes cathode end - Weight: 0.0006 ounce, 0.0173 gram - Standrad Packaging: 8mm tape (EIA-481) 0 . 11 5 ( 2 . 9 0 ) 0.106(2.70) 0.145(3.70) 0.137(3.50) 0.030(0.75) 0.017(0.45) Cathode Anode 0.008(0.20) 0.004(0.10) 0.075(1.90) 0.067(1.70) 0.044(1.10) 0.031(0.80) 0.043(1.08) 0.038(0.98) MAXIMUM RATINGS AND...