ZMM55-C51 Datasheet | PanJit Semiconductor

FEATURES - Planar Die construction - 500m W Power Dissipation - Ideally Suited for Automated Assembly Processes - Lead free in pliance with EU Ro HS 2011/65/EU directive MECHANICAL DATA - Case: Molded Glass MINI-MELF - Terminals: Solderable per MIL-STD-750, Method 2026 - Polarity: See Diagram Below - Approx. Weight: 0.03 grams - Packing information T/R - 2.5K per 7" plastic Reel T/R - 10K per 13" plastic Reel 0.020(0.5) 0.012(0.3) 0.146(3.7) 0.130(3.3) 0.020(0.5) 0.012(0.3) 0.063(1.6) 0.055(1.4)DIA. MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Parameter Power Dissipation at TA = 25OC Operating Junction Temperature Range Storage Temperature Range Symbol PTOT TJ TS Value 500 -65 to +175 -65 to +175 Units m W OC OC Parameter Thermal Resistance Junction to Ambient Air Forward Voltage at IF = 200m A Symbol Min. Typ. Max. Units RθJA -- -- 0.3 o C/m W VF -- -- 1.5...